"Unpackaged chip" literally is a chip process that does not involve the packaging factory. In fact, it is only the chip factory that has done the work of the packaging factory.
The industry said that there is no big cost advantage for unpackaged chips, and the market share is not large. But in turn there is no big market, and naturally there is no cost reduction brought about by the scale effect. We can't deny that it is the technology trend of the next package.
At present, there is a high-voltage linear constant current driving method in the Power Supply industry, which is also a combination of the power source and the light source that we have traditionally seen. This unpackaged chip also integrates the chip and package.
In recent years, many new technologies, such as light engines and LED integrated lights, have also become more "integrated". Tian Jie, manager of Zhuo Nai Marketing Center, said that the biggest advantage of integration lies in the reduction of devices and the reduction of final cost.
"'Integration' makes the boundary between upstream and downstream become less clear." Tang Guoqing said that if the large-scale promotion of unpackaged chips will make the boundaries between the packaging factory and the chip factory less clear.
Chen Zhengyan believes that the package-free technology is a technology integration. The packaging process includes wire bonding, phosphor coating, heat treatment, electrical connection, etc. The package-free package represents the chip and can be sent to the lighting factory for use. The packaging plant will no longer be downstream of the chip factory, but affiliated.
However, Tang Guoqing does not agree with this view. Although it is only necessary to attach the aluminum substrate, it is not without technical requirements. The industry has a specialization, and the advantage of the chip factory is still the extension process. At present, Samsung LED has no related products, but he believes that if the pure chip factory that did not package before produces the package-free chip, more will consider the packaging factory OEM and will not do it by itself. However, it is not ruled out that in the future, lighting companies will buy their own equipment and use their own bare die to attach aluminum substrates.
A deputy general manager of a packaging factory in Shenzhen said that if this package-free chip is fully promoted, the packaging factory can only be ready to go out of business. Because this live if the chip factory really does not want to do, the downstream lighting factory can also do a few equipment. This point Zheng Tiemin said that he said that many lighting factories now have the ability to directly package the die of the chip factory, as long as they buy equipment. But he believes that most of the packaging plants now have their own lighting production lines, so the impact will not be too great.
Gong Wen, general manager of Jingtai Optoelectronics, believes that there should be thousands of packaging devices in operation around the world. Even if the package-free chips are widely promoted, such a large package capacity cannot be completely disappeared. However, he also strongly agrees with the concept of integration. "COB Our next research and development direction is to integrate the power supply and control system in a chip-level manner. It can be used after power-on, which will save costs, such as IC. Manufacturing costs. At the same time, this method is more convenient and more reliable."
[Note: This article is the exclusive report of Gaogong LED . Please reprint the agreement in advance. For legal reprint, please refer to: Gaogong LED copyright maintenance - "anti-infringement action" statement , otherwise it will be regarded as illegal reprint, this website will be held legally responsible ! 】
The industry said that there is no big cost advantage for unpackaged chips, and the market share is not large. But in turn there is no big market, and naturally there is no cost reduction brought about by the scale effect. We can't deny that it is the technology trend of the next package.
At present, there is a high-voltage linear constant current driving method in the Power Supply industry, which is also a combination of the power source and the light source that we have traditionally seen. This unpackaged chip also integrates the chip and package.
In recent years, many new technologies, such as light engines and LED integrated lights, have also become more "integrated". Tian Jie, manager of Zhuo Nai Marketing Center, said that the biggest advantage of integration lies in the reduction of devices and the reduction of final cost.
"'Integration' makes the boundary between upstream and downstream become less clear." Tang Guoqing said that if the large-scale promotion of unpackaged chips will make the boundaries between the packaging factory and the chip factory less clear.
Chen Zhengyan believes that the package-free technology is a technology integration. The packaging process includes wire bonding, phosphor coating, heat treatment, electrical connection, etc. The package-free package represents the chip and can be sent to the lighting factory for use. The packaging plant will no longer be downstream of the chip factory, but affiliated.
However, Tang Guoqing does not agree with this view. Although it is only necessary to attach the aluminum substrate, it is not without technical requirements. The industry has a specialization, and the advantage of the chip factory is still the extension process. At present, Samsung LED has no related products, but he believes that if the pure chip factory that did not package before produces the package-free chip, more will consider the packaging factory OEM and will not do it by itself. However, it is not ruled out that in the future, lighting companies will buy their own equipment and use their own bare die to attach aluminum substrates.
A deputy general manager of a packaging factory in Shenzhen said that if this package-free chip is fully promoted, the packaging factory can only be ready to go out of business. Because this live if the chip factory really does not want to do, the downstream lighting factory can also do a few equipment. This point Zheng Tiemin said that he said that many lighting factories now have the ability to directly package the die of the chip factory, as long as they buy equipment. But he believes that most of the packaging plants now have their own lighting production lines, so the impact will not be too great.
Gong Wen, general manager of Jingtai Optoelectronics, believes that there should be thousands of packaging devices in operation around the world. Even if the package-free chips are widely promoted, such a large package capacity cannot be completely disappeared. However, he also strongly agrees with the concept of integration. "COB Our next research and development direction is to integrate the power supply and control system in a chip-level manner. It can be used after power-on, which will save costs, such as IC. Manufacturing costs. At the same time, this method is more convenient and more reliable."
[Note: This article is the exclusive report of Gaogong LED . Please reprint the agreement in advance. For legal reprint, please refer to: Gaogong LED copyright maintenance - "anti-infringement action" statement , otherwise it will be regarded as illegal reprint, this website will be held legally responsible ! 】
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