[Text / high-tech LED reporter Wen Zhao] When most mid-stream packaging companies are thinking about how to get rid of the situation of increasing revenue and not increasing profits, a new chip packaging process has attracted the attention of the industry, and even many industry insiders predict this process. Will become the mainstream technology of LED packaging in the future, it is "chip-scale packaging."
First of all, a concept is popularized. The so-called "no package" or "free package" refers to the "chip-level package", that is, the flip chip is directly sealed to the pad on the bottom of the package, without gold wires, without a bracket. This simplifies the production process, reduces production costs, and allows package sizes to be made smaller, while the same package size provides more power.
This change in the packaging industry this year is particularly evident. In the past few years, chip-level packaging has only been used as a technical reserve, and new products based on this technology have been introduced, which further confirms the spring of the chip-level packaging market.
As a pioneer in chip-level packaging, Hu Shuangneng, director of the sales center of Shenzhen Getian Optoelectronics Co., Ltd., clearly said in an interview with “High-Tech Reporterâ€: “In 2014, LED chip-level packaging technology has improved significantly, and its performance advantage. Obviously, with the further maturity and popularity of future technologies, the cost is bound to decline."
In addition, with the popularity of LED lighting, the price of the entire industry chain continues to fall, and upstream chip companies with relatively high profits are no exception. The relatively popularization of the chip technology makes the market competition extremely hot, and the price and profit rate continue to fall. Through technological innovation, introducing new products and reducing chip size to obtain higher gross profit margin will become the common goal of LED chip manufacturers. Therefore, many of the performance advantages of chip-level packaging have attracted the attention of many LED lighting manufacturers.
Although chip-level packaging has many advantages, it is still in the early days of China. Its core technology is also in the hands of some international big companies in the industry. Domestic enterprises are currently engaged in research and development due to various limitations in technology, talents and equipment. The business is still not too much.
Of course, there are also some companies that try first. Taking Getian Optoelectronics as an example, as early as 2011, the company was keenly aware of the LED packaging market trend, and combined with the industry and enterprise strategy, began to enter the chip-level packaging field. Hu Shuangneng believes that the future market prospects will be increasingly concerned by chips and packaging manufacturers, accelerating the LED packaging revolution.
As the industry's highest specification and largest industry event in the LED industry, it is also the best platform for the annual LED industry's year-end review, analysis and outlook. So far, the high-tech LED conference has been successfully held for four sessions. The 5th High-tech LED Conference will also be held at the Guanlan Lake Dongguan Club in Shenzhen on December 12-13, 2014. Getian Optoelectronics will share the keynote speech on chip-level packaging at the theme conference of the 2014 High-tech LED Annual Conference on the afternoon of December 13th. How much will the future chip-scale packaging market scale be? How should the packaging company respond to the layout? Welcome to attend by then!
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