Kailuo Laser Brings the Latest LED Sapphire Ultraviolet Laser Scriber to Debut at the High-tech LED Exhibition

"Since the LED industry is an emerging sunrise industry, it must go through the early stage of growth and cultivation, and even encounter twists and turns, which is normal." Jiangsu Qihao Laser Technology Co., Ltd. (hereinafter referred to as "Qiqi Laser") Manager Peng Xuanqi has a clear understanding of the development of the LED industry. He said: "The development of the LED industry in the early stage needs to rely on the promotion of government policies, so that the market will gradually mature and order, and then it will usher in a period of rapid development."

Kailuo Laser specializes in R&D, manufacturing and sales of laser precision processing applications, focusing on new energy fields (LED industry and solar photovoltaic industry). Peng Xuanqi said that although Kailuo Laser entered the LED industry soon, the company has 22 years of R&D foundation, technology accumulation and engineering experience in laser precision machining applications, so he believes that it will move faster and more stable in the LED field.

At the high-tech LED exhibition to be held on August 17th, Kailuo Laser will launch the latest version of the LED sapphire UV laser dicing machine for the first time.

"The LED industry needs to make great progress and development. It requires the industry peers to work together to make the cake bigger. This requires two conditions, one is technological progress, and the other is cost reduction." Peng Xuanqi said that Kailuo Laser is a equipment supplier. In the future, we will pay more attention to the optimization and improvement of equipment performance, and improve equipment operation speed and processing efficiency, yield, operation stability and reliability. At the same time, it will pay more attention to reducing the comprehensive cost of equipment, including the use cost, maintenance cost, extending the equipment warranty period, and maximizing equipment cost performance.

LED sapphire UV laser dicing machine technical features:
1. Automation and intelligence, 3 sets of CCD image automatic identification tracking and positioning system, support back cut and tangent; auto focus, anti-roughening vision system; automatic template recognition, angle correction; automatic contour search, contour correction; automatic feeding and discharging, One-button operation.
2, high speed, can achieve more than 100mm / s running speed, 2 inch 15 / hour processing cycle.
3, high precision, using natural granite base platform, linear motor drive, grating ruler 0.1um resolution closed-loop control, XYZ axis 0.1um resolution, θ axis 0.0001 ° rotation accuracy.
4, high stability and high reliability, normal running time (Average) 95%, mean time between failure (MTBF) 5000 hours, average repair time (MTTR) 8 hours.
5, expandability, 200mm effective motion range, compatible with 2 inch, 4 inch, 6 inch specifications, suitable for slash cutting of Sapphire, SiC and other substrates and epitaxial wafers.

2012 High-tech LED Exhibition Exhibition Address: Guangzhou Poly World Trade Center Expo Booth No.: 2E02
Exhibition date: August 17-19, 2012

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