The IP (INTERNATIONAL PROTECTION) degree of protection is a specialized industrial protection class that classifies appliances according to their dust and moisture resistance. The IP protection level consists of two numbers. The first digit indicates the level of electrical dust and prevention of foreign objects. The second digit indicates the degree of airtightness of the appliance against moisture and water intrusion. The larger the number, the higher the protection level. High, the protection levels indicated by the two marked numbers are as follows:
Dust rating (first number)
0: no protection
1: Objects with a diameter of 50mm must not completely enter the shell
2: Objects with a diameter of 12.5mm must not completely enter the shell
3: Each vertical surface is sprayed within 60 degrees without harmful effects
4: Objects with a diameter of 1.0mm must not enter the shell at all.
5: The dust cannot be completely prevented from entering, but the amount of dust entering must not affect the normal operation of the equipment and must not affect safety.
6: no dust entering
Waterproof rating (second number)
0: no protection
1: dripping water in the vertical direction has no harmful effects
2: Vertical water droplets have no harmful effects when the vertical faces of the outer casing are inclined within 15 degrees.
3: The object with a diameter of 2.5mm is completely free from entering the shell.
4: Splashing water in all directions of the shell has no harmful effects
5: Spraying water in all directions of the shell has no harmful effects
6: Strong water spray in all directions of the shell has no harmful effects
7: Short-term immersion has no effect
8: Continuous diving has no effect
Examples are as follows:
IP65 protection level meaning: completely dust-proof, spray water in all directions of the shell without harmful effects
IP66 protection level meaning: completely dust-proof, strong water spray in all directions of the shell has no harmful effects.
Edit: Pony
Do you know what is ENEPIG in PCB?
What is ENEPIG?ENEPIG-Electroless Nickel Electroless Palladium Immersion Gold is a surface finish for Printed Circuit Boards.ENEPIG works well with lead free and conventional eutectic solder alloys.This is the best way for gold wire bonding. Advantages for ENEPIG:
1.[Black Nickel" free – no possibility of grain boundary corrosion of nickel surface by immersion gold
2.Palladium acts as an additional barrier layer to further reduce copper diffusion to surface, thus ensuring good solderability
3.Palladium completely dissolves into solder, without leaving an excessively high P% rich interface, exposing an oxide-free nickel surface allowing reliable formation of Ni/Sn intermetallic
5.Withstands multiple lead-free reflow soldering cycles
6.Demonstrates excellent gold wire bondability
7.Process costs substantially lower than electrolytic nickel gold or electroless nickel electroless gold
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